Please use this identifier to cite or link to this item: http://hdl.handle.net/10773/21048
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dc.contributor.authorDarby, M. S. B.pt
dc.contributor.authorKarpinsky, D. V.pt
dc.contributor.authorPokorny, J.pt
dc.contributor.authorGuerin, S.pt
dc.contributor.authorKholkin, A. L.pt
dc.contributor.authorMiao, S.pt
dc.contributor.authorHayden, B. E.pt
dc.contributor.authorReaney, I. M.pt
dc.date.accessioned2017-12-07T20:08:40Z-
dc.date.issued2013pt
dc.identifier.issn0040-6090pt
dc.identifier.urihttp://hdl.handle.net/10773/21048-
dc.description.abstractThe high throughput synthesis of BiFeO3 and rare earth doped BiFeO3 films using a modified molecular beam epitaxy technique is reported. Optimum conditions for deposition have been established and compositionally graded Bi(1- x)NdxFeO3 (x = 0.08 to 0.24) thin films have been fabricated on platinised silicon substrate (Si/ SiO2/TiO2/Pt) with the aim of finding the optimum Nd dopant concentrations for enhanced piezoelectric properties. For x<0.12, the structure and symmetry were identical to that of the R3c BiFeO3 end member. For x > 0.20, the structure and symmetry were consistent with the NdFeO3 end member (Pnma). For compositions 0.12 < x < 0.2, a gradual transition from R3c to Pnma was observed via a mixed phase region but no compositional interval could be unambiguously identified in which the intermediate PbZrO3-like structure, reported by Karimi et al. (2009) [6], existed as a single phase. Piezoresponse force microscopy remanent hysteresis measurements of the film revealed a statistical increase in the piezoelectric response at x approximate to 0.11 within the R3c region adjacent to the mixed phase field. (c) 2012 Elsevier B.V. All rights reserved.pt
dc.language.isoengpt
dc.publisherELSEVIER SCIENCE SApt
dc.relationinfo:eu-repo/grantAgreement/FCT/SFRH/SFRH%2FBPD%2F42506%2F2007/PTpt
dc.relationinfo:eu-repo/grantAgreement/FCT/COMPETE/132936/PTpt
dc.rightsrestrictedAccesspor
dc.subjectBIFEO3pt
dc.titleSynthesis and characterization of Bi-1 (-) xNdxFeO3 thin films deposited using a high throughput physical vapour deposition techniquept
dc.typearticlept
dc.peerreviewedyespt
ua.distributioninternationalpt
degois.publication.firstPage56pt
degois.publication.lastPage60pt
degois.publication.titleTHIN SOLID FILMSpt
degois.publication.volume531pt
dc.date.embargo10000-01-01-
dc.relation.publisherversion10.1016/j.tsf.2012.12.012pt
dc.identifier.doi10.1016/j.tsf.2012.12.012pt
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