Please use this identifier to cite or link to this item: http://hdl.handle.net/10773/41197
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dc.contributor.authorMendes, Joana C.pt_PT
dc.contributor.authorRodrigues, Luis A.pt_PT
dc.contributor.authorKyatam, Sushmithapt_PT
dc.contributor.authorAlves, Luis N.pt_PT
dc.contributor.authorPereira, Luizpt_PT
dc.date.accessioned2024-03-22T18:23:44Z-
dc.date.available2024-03-22T18:23:44Z-
dc.date.issued2023-05-07-
dc.identifier.isbn979-8-3503-3283-4-
dc.identifier.issn2475-9481-
dc.identifier.urihttp://hdl.handle.net/10773/41197-
dc.description.abstractHigh power light emitting diodes (LEDs) are much more efficient than conventional light sources like filament bulbs. Nevertheless, heat is still generated, and this directly affects the reliability of these solid-state light (SSL) devices. In order to decrease the operating temperature, these LEDs can be assembled on metal core printed circuit boards (MCPCBs). However, in applications where stability/lifetime is a critical parameter, such as space applications, diamond plates may be considered. These plates are available from manufacturers with metallized tracks for direct assemblage of surface mount devices (SMD). In order to evaluate the impact of the board on SSL reliability, high power Cree LEDs were assembled on MCPCB and diamond plates. The case temperature was measured for different current ratings and the life-time increase induced by the diamond plate was estimated based on the calculation of the acceleration factor (AF). Diamond plates were shown to have a big impact on the life-time; for nominal current level, and depending on the activetion energy of the aging processes, the LED assembled on the MCPCB will age 2.5-8.8 times faster than the one assembled on the diamond plate. For high current ratings the spectrum radiated by the LED assembled on the diamond plate was also shown to be more stable than the one on the MCPCB.pt_PT
dc.language.isoengpt_PT
dc.publisherIEEEpt_PT
dc.relationinfo:eu-repo/grantAgreement/FCT/6817 - DCRRNI ID/UID%2FEEA%2F50008%2F2019/PTpt_PT
dc.relationinfo:eu-repo/grantAgreement/FCT/6817 - DCRRNI ID/UIDB%2F50008%2F2020/PTpt_PT
dc.relationinfo:eu-repo/grantAgreement/FCT/6817 - DCRRNI ID/UIDP%2F50008%2F2020/PTpt_PT
dc.relationinfo:eu-repo/grantAgreement/FCT/6817 - DCRRNI ID/UIDB%2F50025%2F2020/PTpt_PT
dc.relationinfo:eu-repo/grantAgreement/FCT/6817 - DCRRNI ID/UIDP%2F50025%2F2020/PTpt_PT
dc.rightsrestrictedAccesspt_PT
dc.subjectLEDpt_PT
dc.subjectMTTFpt_PT
dc.subjectAFpt_PT
dc.subjectRadiated spectrumpt_PT
dc.subjectDiamondpt_PT
dc.subjectPower boardpt_PT
dc.subjectThermal managementpt_PT
dc.titleImproving the reliability of power LEDs with diamond boardspt_PT
dc.typebookPartpt_PT
dc.description.versionpublishedpt_PT
dc.peerreviewedyespt_PT
ua.event.date7-10 May, 2023pt_PT
degois.publication.title2023 IEEE 27th Workshop on Signal and Power Integrity (SPI)pt_PT
dc.identifier.doi10.1109/SPI57109.2023.10145530pt_PT
dc.identifier.essn2835-0898-
dc.identifier.esbn979-8-3503-3282-7-
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