Please use this identifier to cite or link to this item: http://hdl.handle.net/10773/25120
Title: Proceddings of the 30th International Conference on Software Engineering and Knowledge Engineering
Author: Pereira, Óscar Mortágua
Issue Date: 1-Jul-2018
Publisher: KSI Research Inc. and Knowledge Systems Institute Graduate School, USA
Abstract: Welcome to the 30th International Conference on Software Engineering and Knowledge Engineering (SEKE), in Hotel Pullman, Redwood City, USA. In last 30 years, SEKE has established itself as a major international forum to foster, among academia, industry, and government agencies, discussion and exchange of ideas, research results and experience in software engineering and knowledge engineering. The SEKE community has grown to become a very important and influential source of ideas and innovations on the interplays between software engineering and knowledge engineering, and its impact on the knowledge economy has been felt worldwide. On behalf of the Program Committee, it is my great pleasure to invite you to participate, not only in the technical program of SEKE 2018 and its rich assortment of activities, but also in enjoying the beautiful San Francisco Bay Area. This year, we received 214 submissions from 32 countries. Through a rigorous review process where a majority (90 percent) of the submitted papers received three reviews, and the rest with two reviews, we were able to select 75 full papers for the general conference (35 percent), 72 short papers (34 percent), 35 posters (16 percent) and 32 (15 percent) reject. Out of that, 15 papers have been accepted for the 3 special sessions (SESE 4 papers, DISA 7 papers and LATTICE 4 papers), and 132 papers are scheduled for presentation in thirty five sessions during the conference. In addition, the technical program includes three excellent keynote speeches, as well as the special sessions on Semantic Enabled Software Engineering (SESE), Data Intensive Servicebased Applications (DISA) and Conceptual Lattices for Software Systems Engineering (LATTICE). The high quality of the SEKE 2018 technical program would not have been possible without the tireless effort and hard work of many individuals. First of all, we would like to express our sincere appreciation to all the authors whose technical contributions have made the final technical program possible. We are very grateful to all the Program Committee members whose expertise and dedication made our responsibility that much easier. Our gratitude also goes to the keynote speakers who graciously agreed to share their insight on important research issues, to the conference organizing committee members for their superb work, and to the external reviewers for their contribution. Personally, we owe a debt of gratitude to a number of people whose help and support with the technical program and the conference organization are unfailing and indispensable. We are deeply indebted to Dr. S. K. Chang, Chair of the Steering Committee, for his constant guidance and support that are essential to pull off SEKE 2018. Our heartfelt appreciation goes to Dr. Xudong He, Florida International University, USA, the Conference Chair, for his help and experience, and to the Program Committee Chair, Dr. Oscar Mortagua Pereira, University of Aveiro, Portugal, and Program Committee Co-Chair, Dr. Angelo Perkusich, Federal, University of Campina Grande, Brazil, for their outstanding team work. In addition, we also like to express our appreciation to Prof. Jing Sun, The University of Auckland, New Zealand, to Prof. Honghao Cao, Shangai University, China, and to Prof. Iaakov Exman, The Jerusalem College of Engineering, Israel, for their excellent job in organizing the special sessions SESE, DISA and LATTICE, respectively. We would like also to express our great appreciation to all of the conference organization committee members, including the Publicity Chair, Dr. Robert Heinrich, Karlsruhe Institute of Technology, Germany, Poster Session Chair, Dr. Shi-Kuo Chang, University of Pittsburgh, USA. Moreover, we would like to appreciate and recognize our Conference Liaisons in different regions for their important contributions. They are: Asia Liaison – Hironori Washizaki, Waseda University, Japan; Australasia Liaison – Jing Sun, The University of Auckland, New Zealand; Europe Liaison - Raul Garcia Castro, Universidad Politecnica de Madrid, Spain; India Liaison - Swapan Bhattacharya, National Institute of Technology Karnataka, Surathakl; and South America Liaison - Jose Carlos Maldonado, ICMC-USP, Brazil. We would like to express our great appreciation for the availability expressed by Dr. Bingyang Wei, Midwestern State University, USA, Dr. Yong Wang, New Mexico Highlands University, USA, Dr. Angelo Perkusich, Federal University of Campina Grande, Brazil, Dr. Xudong He, Florida International University, USA, and Dr. Oscar Mortagua Pereira, University of Aveiro, Portugal, to dedicate an outstanding effort on the reviewing process of papers. Last but certainly not the least, we must acknowledge the important contributions that the KSI staff members have made. Their timely and dependable support and assistance throughout the entire process have been truly remarkable. Finally, we wish you have productive discussion, great networking, effective presentation, and pleasant stay and travel in San Francisco to participate in SEKE 2018. Finally, to conclude, we are happy to announce that SEKE 2019 will take place in Lisbon, the stunning capital of Portugal and one of the capitals of Western Europe with greater notoriety. Lisbon is a city with more than 800 years where historical heritage, modernism, culture and nightlife combine in a perfect harmony. The excellence of the climate and the sympathy of the Portuguese population associated with the diversity and quality of the opportunities offered leave visitors with a desire to return to Lisbon. Lisbon and Portugal have recently won several international awards as destinations of excellence, such as those from the World Travel Award.
URI: http://hdl.handle.net/10773/25120
DOI: 10.18293/SEKE2018
ISBN: 1-891706-44-6
Appears in Collections:DETI - Livro

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