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 Effects of temperature and loading rate on the mechanical properties of a high temperature epoxy adhesive
Please use this identifier to cite or link to this item http://hdl.handle.net/10773/8418

title: Effects of temperature and loading rate on the mechanical properties of a high temperature epoxy adhesive
authors: Banea, M. D.
Sousa, F. S. M. de
Silva, L. F. M. da
Campilho, R. D. S. G.
Pereira, A. M. de Bastos
keywords: high temperature adhesives
temperature tests
tensile strength
test speed
issue date: 2011
publisher: Brill Academic Publishers
abstract: The variation of the mechanical properties of adhesives with temperature and strain rate is one of the most important factors to consider when designing a bonded joint due to the polymeric nature of adhesives. It is well known that adhesive strength generally shows temperature dependence. Moreover, in many structural applications, the applied loads can be dynamic and the design of the joint requires the knowledge of the high loading rate mechanical behaviour of the adhesive. In this study, the combined effect of the temperature and test speed on the tensile properties of a high temperature epoxy adhesive was investigated. Tensile tests were performed at three different test speeds and various temperatures (room temperature (RT) and high temperatures (100, 125 and 150◦C)). The glass transition temperature (Tg) of the epoxy adhesive investigated is approximately 155◦C. The ultimate tensile stress decreased linearly with temperature (T) while increased logarithmically with the loading rate, which is in the accord with the Airing’s molecular activation model.
URI: http://hdl.handle.net/10773/8418
ISSN: 0169-4243
publisher version/DOI: http://dx.doi.org/10.1163/016942411X580144
source: Journal of Adhesion Science and Technology
appears in collectionsMEC - Artigos

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